捆绑SM社区

Event

TechIdea Submission Deadline

Tuesday, November 24, 2020toSunday, January 3, 2021

The competition encourages 捆绑SM社区 students, working in teams, to propose new technologically-based ideas/solutions in the form of new products, services and/or ventures to solve real world problems.听

How It Works

  1. Submit your听TechIdea听before the newdeadline on听January 3rd, 2021 at 11:59PM (EST)
  2. Top 5 ideas are selected and coaching is provided to help them develop听their pitch听听
  3. The 5 finalists pitch their idea during the annual听John D. Thompson Entrepreneurial Development Seminar听(takes听place during听EUS TechWeek)
  4. The top 3 pitches will win cash prizes of $500, $250 and $100

Pitch Details听

  • Each team will have 5听minutes听to present their idea or solution in an "elevator pitch" format to a panel of judges from the business and technical community.听This will challenge students to present themselves, and their idea, in a concise and convincing way.
  • Judges will have 2 minutes to ask questions and give feedback.
  • See the 2020 Pitch Competition Winners here!

Eligibility

  • Open to any 捆绑SM社区 student team comprised of 2 to 4 members where at least one member is a currently enrolled student, undergraduate or graduate, in 捆绑SM社区鈥檚 Faculty of Engineering.
  • If you have already developed your solution and are beyond the idea stage (e.g. already have sales/customer transactions or have raised company funding from sources other than friends and family), then you are not eligible.

Lear more about the process, judging and pitching criteria!

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