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Overview
Electrical Engineering : Discussion of high performance heterogeneous integration systems. Introduction to key design challenges, including interconnect, power delivery, synchronization, and testing, with respect to heterogeneous systems. Analysis of state-of-the-art integration platforms, such as three-dimensional integrated circuits, wafer-scale integration, and flexible substrates with respect to applications of interest. System-level perspective of the integration hierarchy (i.e., integrated circuit, package, and board).
Terms: Winter 2023
Instructors: Vaisband, Boris (Winter)
Prerequisites: ECSE 335 or permission of instructor.
