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Vue d'ensemble
G茅nie 茅lectrique : Interconnect structures, signal integrity issues: reflection, crosstalk, noise, electromagnetic interference, Lossy transmission lines, RLGC matrix representations, wave propagation in multilayered substrates, periodically loaded lines, Floquet's theorem, power distribution network, simultaneous switching noise, packaging structures, chip interconnection technologies, substrate integrated waveguides, methods for experimental characterization of interconnects, signal integrity CAD tools.
Terms: This course is not scheduled for the 2016-2017 academic year.
Instructors: There are no professors associated with this course for the 2016-2017 academic year.