捆绑SM社区

Would you like to receive the MIAM newsletter and be notified of future MIAM events?

Event

Call for Applications: TechAccel Program Winter 2025

Monday, December 2, 2024toSunday, January 12, 2025

Application Deadline: January 12, 2025, at 11:59 PM ET聽-聽

The TechAccel Program is one of the 捆绑SM社区 Engine鈥檚 key co-curricular/experiential learning programs. It supports early-stage student ventures with聽Lean Startup Methodology training, 1:1聽business mentorship, and project funding. The program runs three times a year during the Fall, Winter, and Summer semesters, each cohort is about 12 weeks long.聽We help student technological innovators make a positive impact on the world!

Back to top